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  h04-004-07 fuji electric co.,ltd. matsumoto factory specification device name : type name : spec. no. : igbt - ipm 7mbp75rtb060 ms6m 0653 1 23 ms6m 0653 sep. 17 '02 k.sekigawa k.yamada t.fujihira nishiura sep.-17 -'02 a sep. 17 '02
h04-004-06 r e v i s e d r e c o r d s date classi- fication ind. content applied date drawn checked approved enactment issued date ms6m 0653 2 22 k.yamada sep.-17-'02 t.fujihira k.sekigawa nishiura a k.yamada apr.-09-'03 t.fujihira n.matsuda t.miyasaka revision a reliability test items. apr.-09-'03
h04-004-03 23 ms6m 0653 a 3 7mbp75rtb060 1. outline drawing ( unit : mm ) p n w v u b 109 109 109 109 95 95 95 95 67.4 67.4 67.4 67.4 15.24 15.24 15.24 15.24 5.08 5.08 5.08 5.08 5.08 5.08 5.08 5.08 10.16 10.16 10.16 10.16 10.16 10.16 10.16 10.16 10.16 10.16 10.16 10.16 13.8 13.8 13.8 13.8 5.5 5.5 5.5 5.5 5.08 5.08 5.08 5.08 2.54 2.54 2.54 2.54 3.22 3.22 3.22 3.22 88 88 88 88 74 74 74 74 20 20 20 20 20 20 20 20 17 17 17 17 10 10 10 10 2 2 2 2 0.5 0.5 0.5 0.5 24 24 24 24 26 26 26 26 26 26 26 26 0.5 0.5 0.5 0.5 0.3 0.3 0.3 0.3 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.3 0.3 0.3 0.3 1 1 1 1 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 1 1 1 1 4- 4- 4- 4- 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.25 0.25 0.25 0.25 0.1 0.1 0.1 0.1 8 8 8 8 31 31 31 31 22 22 22 22 17 17 17 17 9 9 9 9 7 7 7 7 22 22 22 22 0.64 0.64 0.64 0.64 2.5 2.5 2.5 2.5 -0.3 -0.3 -0.3 -0.3 -0.2 -0.2 -0.2 -0.2 16- 16- 16- 16- 2- 2- 2- 2- +1.0 +1.0 +1.0 +1.0 +1.0 +1.0 +1.0 +1.0 -0.3 -0.3 -0.3 -0.3 +1.0 +1.0 +1.0 +1.0 14.5 14.5 14.5 14.5 6-m5 2.54 2.54 2.54 2.54 2.54 2.54 2.54 2.54 3.22 3.22 3.22 3.22 2 2 2 2 2 2 2 2 2 2 2 2 4.5 4.5 4.5 4.5 0.1 0.1 0.1 0.1 0.1max 0.1max 0.1max 0.1max 0.3 0.3 0.3 0.3 0.1 0.1 0.1 0.1 2.5 2.5 2.5 2.5 10 10 10 10 8 8 8 8 1 1 1 1 0.3 0.3 0.3 0.3 details of control terminals 0.64 ( 1 1.5) (1 2) indication of lot no. odered no. in monthly manufactured month last digit of manufactured year (jan. sep.:1 9,oct.:o,nov.:n,dec.:d) lot no. dimensions in mm package type : p610 1 1 1 14 4 4 47 7 7 710 10 10 10 16 16 16 16 a
h04-004-03 23 ms6m 0653 a 4 2 pin descriptions main circuit description positive input supply voltage. output (u). output (v). output (w). negative input supply voltage. collector terminal of brake igbt. control circuit symbol description gndu high side ground (u). vinu logic input for igbt gate drive (u). vccu high side supply voltage (u). gndv high side ground (v). vinv logic input for igbt gate drive (v). vccv high side supply voltage (v). gndw high side ground (w). vinw logic input for igbt gate drive (w). vccw high side supply voltage (w). gnd low side ground. ? vcc low side supply voltage. ? vindb logic input for brake igbt gate drive. ? vinx logic input for igbt gate drive (x). ? viny logic input for igbt gate drive (y). ? vinz logic input for igbt gate drive (z). ? alm low side alarm signal output. b w n symbol p u v
h04-004-03 23 ms6m 0653 a 5 3. block diagram pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver over heat ing prot ect ion circuit 3 r alm u v w n b p vccu vccv vinu gndu vccw vinw gndw vinv gndv vcc vinx gnd viny vinz vindb alm v z v z v z v z v z 1. 5k v z v z 2 1 6 5 4 9 8 7 11 13 10 14 15 12 16 pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver over heat ing prot ect ion circuit 3 r alm u v w n b p vccu vccv vinu gndu vccw vinw gndw vinv gndv vcc vinx gnd viny vinz vindb alm v z v z v z v z v z 1. 5k v z cv vinu gndu vccw vinw gndw vinv gndv vcc vinx gnd viny vinz vindb alm v z v z v z v z v z 1. 5k v z v z 2 1 6 5 4 9 8 7 11 13 10 14 15 12 16 pre-drivers include following functions 1 amplifier for driver 2 short circuit protection 3 under voltage lockout circuit 4 over current protection 5 igbt chip over heating protection
h04-004-03 23 ms6m 0653 a 6 4 absolute maximum ratings tc 25 unless otherwise specified. symbol min. max. units bus voltage dc v dc 0 450 v (between terminal p and n) surge v dc(surge) 0 500 v shortoperating vsc 200 400 v collector-emitter voltage *1 vces 0 600 v dc ic - 75 a collector current 1ms icp - 150 a duty=75.0 % *2 -ic - 75 a collector power dissipation one transistor *3 pc - 198 w collector current dc ic - 50 a 1ms icp - 100 a forward current of diode if - 50 a collector power dissipation one transistor *3 pc - 198 w supply voltage of pre-driver *4 vcc -0.5 20 v input signal voltage *5 vin -0.5 vcc+0.5 v input signal current iin - 3 ma alarm signal voltage *6 valm -0.5 vcc v alarm signal current *7 alm -20ma junction temperature tj - 150 operating case temperature topr -20 100 storage temperature tstg -40 125 isolating voltage (terminal to base, 50/60hz sine wave 1min.) *8 screw torque terminal (m5) mounting (m5) note *1 vces shall be applied to the input voltage between terminal p and u or or w or db, n and u or v or w or db *2 125 /fwd rth(j-c)/(icvf max)=125/0.855/(752.6)100=75.0% *3 pc=125 /igbt rth(j-c)= 125/0.63=198w [inverter] pc=125 /igbt rth(j-c)= 125/0.63=198w [break] *4 vcc shall be applied to the input voltage between terminal no.3 and 1,6 and 4, 9 and 7, 11 and 10. *5 v shall be applied to the input voltage between terminal no.2 and 1, 5 and 4, 8 and 7, 13,14,15 and 10. *6 shall be applied to the voltage between terminal no.16 and 10. *7 shall be applied to the input current to terminal no.16. *8 50hz/60hz sine wave 1 minute. - v nm 3.5 - items viso - ac2500 inverter brake
h04-004-03 23 ms6m 0653 a 7 5. electrical characteristics tj 25 vcc 15v unless otherwise specified. 5.1 main circuit symbol min. typ. max. units collector current 600v at off signal input vin terminal open. collector-emitter ? 75a terminal - - 2.4 saturation voltage chip - 2.0 - v - ? 75a terminal - - 2.6 chip - 1.6 - v collector current 600v at off signal input vin terminal open. collector-emitter ? 50a terminal - - 2.2 saturation voltage chip - 1.75 - v - ? 50a terminal - - 3.3 chip - 1.9 - v turn-on time ton v dc 300v tj= 125 1.2 - - turn-off time toff ic 75a fig.1 fig.6 - - 3.6 us trr v dc 300v if 75a fig.1 fig.6 p av internal wiring maximum avalancheenergy inductance 50nh 40 - - mj main circuit wiring inductance 54nh 5.2 control circuit symbol min. typ. max. units supply current switching frequency supply current iccn tc -20 125 fig.7 on 1 1.35 1.7 off 1.25 1.6 1.95 input zener voltage vz rin 20k ? -8.0- v tc -20 fig.2 1.1 - - alarm signal hold time talm tc 25 fig.2 - 2.0 - ms tc 125 fig.2 - - 4.0 current limit resistor ralm alarm terminal 1425 1500 1575 ? v ce forward voltage of diode vf i ces : 0 15khz 0.3 - - item conditions item conditions (a non-repetition) reverse recovery time forward voltage of fwd i ces v ce vf v ma ma --18 --65 vin(th) input signal threshold voltage of n-side pre-driver of p-side pre-driver (one unit) iccp ma --1.0ma --1.0 inverter brake
h04-004-03 23 ms6m 0653 a 8 5.3 protection section vcc symbol conditions min. typ. max. units over current protection level tj=125 113 - - of inverter circuit ioc a over current protection level tj=125 75 - - of brake circuit over current protection delay time tdoc tj=125 -5-us sc protection delay time tsc tj=125 fig.4 - - 8 us igbt chips over heating tjoh surface 150 - - protection temperature level of igbt chips over heating protection hysteresis tjh - 20 - over heating protection t oh vdc=0v,ic=0a 110 - 125 temperature level casetemperature over heating protection hysteresis tch - 20 - under voltage protection level vuv 11 - 12.5 v under voltage protection hysteresis vh 0.2 0.5 - 6. thermal characteristics ? item symbol min. typ. max. units junction to case inverter igbt rth(j-c) - - 0.63 thermal resistance *9 fwd rth(j-c) - - 0.855 /w brake igbt rth(j-c) 0.63 case to fin thermal resistance with compound rth(c-f) - 0.05 - 7. noise immunity vdc=300v vcc=15v test circuit fig 5. item conditions min. typ. max. units common mode pulse width 1us,polarity ,10 minuets 2.0 - - kv rectangular noise judge no over-current, no miss operating common mode rise time 1.2us,fall time 50usinterval 20s,10 times 5.0 - - kv lightning surge judge no over-current, no miss operating 8. recommended operating conditions item symbol min. typ. max. units dc bus voltage vdc - - 400 v power supply voltage of pre-driver vcc 13.5 15 16.5 v screw torque (m5) - 2.5 - 3 nm 9. weight item symbol min. typ. max. units weight wt - 450 - g *9 ( for 1device case is under the device ) item
h04-004-03 23 ms6m 0653 a 9 ?h ?h f f 1 /vin vge (inside ipm) fault (inside ipm) /alm gate off on gate on 2ms(typ.) off normal t alm t alm max. t alm max. off fault over-current,over-heat or under-voltage on ?? alarm figure 1. switching time waveform definitions figure 2. input/output timing diagram figure 3. over-current protection timing diagram on /vin ic /alm tdoc ioc off alarm on tdoc necessary conditions for alarm reset (refer to to in figure2.) this represents the case when a failure-causing fault lasts for a period more than talm. the alarm resets when the input vin is off and the fault has disappeared. this represents the case when the on condition of the input vin lasts for a period more than talm. the alarm resets when the vin turns off under no fault conditions. this represents the case when the fault disappears and the vin turns off within talm. the alarm resets after lasting for a period of the specified time talm. when a collector current over the oc level flows and the off command is input within a period less than the trip delay time tdoc, the current is hard-interrupted and no alarm is output. when a collector current over the oc level flows for a period more than the trip delay time tdoc, the current is soft-interrupted. if this is detected at the lower arm igbts, an alarm is output. period : period :
h04-004-03 23 ms6m 0653 a 10 vccu dc 15v + ipm p u v w n 20k vinu gndu sw1 vcc dc 15v 20k vinx gnd sw2 cooling fin earth ac200v 4700p noise ct figure 5. noise test circuit a vcc vin gnd icc p u v w n p.g +8v fsw ipm dc 15v figure 7. icc test circuit figure.4 definition of tsc ic ic ic i alm i alm i alm t sc vcc vin gnd dc 15v dc 300v n + l ipm ic p hcpl- 4504 20k vcc vin gnd dc 15v dc 300v n + l ipm ic p hcpl- 4504 20k figure 6. switching characteristics test circuit
h04-004-03 23 ms6m 0653 a 11 10. truth table 10.1 igbt control the following table shows the igbt on/off status with respect to the input signal vin . the igbt turn-on when vin is at ?low? level under no alarm condition. 10.2 fault detection (1) when a fault is detected at the high side, only the detected arm stops its output. at that time the ipm dosen?t any alarm. (2) when a fault is detected at the low side, all the lower arms stop their outputs and the i p outputs an alarm of the low side. alarm output u-phase v-phase w-phase low side alm high side oc off * * * h uvoff*** h tjoh off * * * h high side oc * off * * h uv * off * * h tjoh * off * * h high side oc * * off * h uv * * off * h tjoh * * off * h oc * * * off l uv * * * off l tjoh * * * off l case tcoh * * * off l * depend on input logic. temperature fault low side u-phase v-phase w-phase input output (vin) (igbt) low on high off
h04-004-03 23 ms6m 0653 a 12 11. cautions for design and application 1. trace routing layout should be designed with particular attention to least stray capacity between the primary and secondary sides of optical isolators by minimizing the wiring length between the optical isolators and the ipm input terminals as possible. ????g?O??????????[ ?`??? 2. mount a capacitor between vcc and gnd of each high-speed optical isolator as close to as possible. ???? vcc-gnd g??????? 3. for the high-speed optical isolator, use high-cmr type one with tphl, tplh Q 0.8s. ????? tphl,tplh Q 0.8us cmr ??? 4. for the alarm output circuit, use low-speed type optical isolators with ctr R 100%. `????? ctr R 100% ??? 5. for the control power vcc, use four power supplies isolated each. and they should be designed to reduce the voltage variations. ? vcc ?~F???????R??O?? 6. suppress surge voltages as possible by reducing the inductance between the dc bus p and n, and connecting some capacitors between the p and n terminals. p-n g?????? p-n g?????A???` ?R?p 7. to prevent noise intrusion from the ac lines, connect a capacitor of some 4700pf between the three-phase lines each and the ground. ac ???`g??????A 8. at the external circuit, never connect the control terminal gndu to the main terminal u-phase, gndv to v-phase, gndw to w-phase, and gnd to n-phase. otherwise, malfunctions may be caused. ?????? v v ??? w w ? ? n ???A?`???? 9. take note that an optical isolator?s response to the primary input signal becomes slow if a capacitor is connected between the input terminal and gnd. -gnd g?????A?????????rgL?? ???
h04-004-03 23 ms6m 0653 a 13 +100 m 0 heat sink mounting holes 10. taking the used isolator?s ctr into account, design with a sufficient allowance to decide the primary forward current of the optical isolator. ?????????? ctr ??]????O?? 11. apply thermal compound to the surfaces between the ipm and its heat sink to reduce the thermal contact resistance. ??????`???g?`????T 12. finish the heat sink surface within roughness of 10m and flatness (camber) between scr e positions of 0 to +100m. if the flatness is minus, the heat radiation becomes worse due t o a gap between the heat sink and the ipm. and, if the flatness is over +100m, there is a d a that the ipm copper base may be deformed and this may cause a dielectric breakdown. ?`?????? 10um ??g ?????? 0 100um ???? ????`??? ipm g?g??? ????? 100um ???~ ????~F????? 13. this product is designed on the assumption that it applies to an inverter use. sufficient examination is required when applying to a converter use. please contact fuji electric co., if you would like to applying to converter use. u??`??m??O???`?m??? ???????`m??Bj 14. please see the fuji igbt-ipm r series application manual and fuji igbt modules n series application manual . ? igbt-ipm r ` ??`???? igbt ?????? n ` ??` ????
h04-004-03 23 ms6m 0653 a 14 + 1 0uf 0. 1 uf 20k vcc i f ? ? ? ? ? ? u v w n b p m + ac200v + 1 0uf 0. 1 uf 20k vcc i f + 1 0uf 0. 1 uf vcc i f 20k + 1 0uf 0. 1 uf 20k vcc i f + 1 0uf 0. 1 uf 20k i f + 1 0uf 0. 1 uf i f 20k + 0. 1 uf i f 20k 1 0uf 5v 1 k ipm 12. example of applied circuit ? 13. package and marking y? please see the mt6m4140 which is packing specification of p610 & p611 & p621 package ?? y? ?? 14. cautions for storage and transportation ?\?? ? store the modules at the normal temperature and humidity (5 to 35c, 45 to 75%). 3? (5 35 45 75%) ?? ? avoid a sudden change in ambient temperature to prevent condensation on the module surfaces. ?`Y?????? ? avoid places where corrosive gas generates or much dust exists. ???k?m??? ? store the module terminals under unprocessed conditions ?`???B???? . ? avoid physical shock or falls during the transportation. \rn??? 15. scope of application m this specification is applied to the igbt-ipm (type: 7mbp75rtb060). ?? igbt-ipm ( ? 7mbp75rtb060) m?? 16. based safety standards ??? ul1557





h04-004-03 23 ms6m 0653 a 20 test cate- gories test items test methods and conditions reference norms eiaj ed-4701 number of sample ac cept- ance number 1 terminal strength pull force : 40 n (main terminal) test method 401 5 ( 1 : 0 ) ? 10 n (control terminal) method (pull test) test time : 10 1 sec. 2 mounting strength screw torque : 2.5 ~ 3.5 n ? m (m5) test method 402 5 ( 1 : 0 ) test time : 10 1 sec. method 3 vibration range of frequency : 10 500 hz test method 403 5 ( 1 : 0 ) sweeping time : 15 min. condition code b ac celeration : 100 m/s 2 sweeping direction : each x,y,z axis test time : 6 hr. (2hr./direction) 4 shock maximum acceleration : 5000 m/s 2 test method 404 5 ( 1 : 0 ) n pulse width 1.0 ms condition code b direction : each x,y,z axis test time : 3 times/direction 5 solderabitlity solder temp. : 235 5 test method 303 5 ( 1 : 0 ) ? immersion duration : 5.0 0.5 sec. condition code a test time : 1 time each terminal should be immersed in solder within 1~1.5mm from the body. 6 resistance to solder temp. : 260 5 test method 302 5 ( 1 : 0 ) soldering heat immersion time : 10 1sec. condition code a ?? test time : 1 time each terminal should be immersed in solder within 1~1.5mm from the body. 1 high temperature storage temp. : 125 5 test method 201 5 ( 1 : 0 ) storage test duration : 1000 hr. 2 low temperature storage temp. : -40 5 test method 202 5 ( 1 : 0 ) storage test duration : 1000 hr. 3 temperature storage temp. : 85 2 test method 103 5 ( 1 : 0 ) humidity storage relative humidity : 85 5% test code c ?? test duration : 1000hr. 4 unsaturated test temp. : 120 2 test method 103 5 ( 1 : 0 ) pressure cooker atmospheric pressure : 1.7x10 5 pa test code e ??`?` test humidity : 85 5% test duration : 96 hr. 5 temperature test temp. : minimum storage temp. -40 5 test method 105 5 ( 1 : 0 ) cycle maximum storage temp. 125 5 ?? normal temp. 5 ~ 35 dwell time : tmin ~ t n ~ tmax ~ t n 1hr. 0.5hr. 1hr. 0.5hr. number of cycles : 100 cycles 6 thermal shock +0 test method 307 5 ( 1 : 0 ) n test temp. : high temp. side 100 -5 method +5 condition code a low temp. side 0 -0 fluid used : pure water (running water) dipping time : 5 min. par each temp. transfer time : 10 sec. number of cycles : 10 cycles mechanical tests environment tests mechanical tests environment tests reliability test items reliability test items reliability test items reliability test items a
h04-004-03 23 ms6m 0653 a 21 test cate- gories test items test methods and conditions reference norms eiaj ed-4701 number of sample acc ept- ance number 1 high temperature test temp. : ta = 125 5 test method 101 5 ( 1 : 0 ) reverse bias (tj Q 150 ) ????? bias voltage : vc = 0.8vces bias method : applied dc voltage to c-e vcc = 15v test duration : 1000 hr. 2 temperature test temp. : 85 2 test method 102 5 ( 1 : 0 ) humidity bias relative humidity : 85 5 % condition code c ??????? bias voltage : vc = 0.8vces vcc = 15v bias method : applied dc voltage to c-e test duration : 1000 hr. 3 intermitted on time : 2 sec. test method 106 5 ( 1 : 0 ) operating life off time : 18 sec. (power cycle) test temp. : ? tj=100 5deg ?A tj Q 150 , ta=25 5 number of cycles : 15000 cycles endurance tests endurance tests a failure criteria failure criteria failure criteria failure criteria item characteristic symbol failure criteria unit note lower limit upper limit electrical leakage current ices - usl2 ma characteristic saturation voltage vce(sat) - usl1.2 v forward voltage vf - usl1.2 v thermal igbt th(j-c) -usl1.2 /w resistance fwd th(j-c) -usl1.2 /w over current protection ioc lsl0.8 usl1.2 alarm signal hold time talm lsl0.8 usl1.2 ms over heating protection tcoh lsl0.8 usl1.2 isolation voltage viso broken insulation - visual visual inspection inspection peeling - the visual sample - plating and the others lsl : lower specified limit. usl : upper specified limit. note : each parameter measurement read-outs shall be made after stabilizing the components at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests. and in case of the wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry completely before the measurement.
h04-004-03 23 ms6m 0653 a 22 1. this product shall be used within its absolute maximum rating (voltage, current, and temperature). this product may be broken in case of using beyond the ratings. u?~???R?????~???????? ??? 2. connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment from causing secondary destruction. ?]1??????]??u?gm?`???`` ???? 3. when studying the device at a normal turn-off action, make sure that working paths of the turn-off voltage and current are within the rbsoa specification. and ,when studying the device duty at a short-circuit current non-repetitive interruption, make sure that the paths are also within the avalanche proof(pav) specification which is calculated from the snubber inductance, the ipm inner inductance and the turn-off current. in case of use of igbt-ipm over these specifications, it might be possible to be broken. ?`???????H??`???R???E rbsoa ??? ?_J?R?j??????H???`?? ????`????? (pav) ???_J ????????? 4. use this product after realizing enough working on environment and considering of product's reliability life. this product may be broken before target life of the system in case of using beyond the product's reliability life. u??h????u?m????u?m?u?m ????????????? 5. if the product had been used in the environment with acid, organic matter, and corrosive gas (for example : hydrogen sulfide, sulfurous acid gas), the product's performance and appearance can not be ensured easily. ?C?????????h????u?C?Q??^ ?? 6. the thermal stress generated from rise and fall of tj restricts the product lifetime. you should estimate the tj from power losses and thermal resistance, and design the inverter lifetime within the number of cycles provided from the power cycle curve. (technical rep. no.: mt6m4057) u??????N????????Q??p??? ? tj ??` `?Q???`O? ( gY mt6m4057) 7. never add mechanical stress to deform the main or control terminal. the deformed terminal may cause poor contact problem. ???????????????? ? warnings
h04-004-03 23 ms6m 0653 a 23 8. according to the outline drawing, select proper length of screw for main terminal. longer screws may break the case. u?????L???x?L?`?p? ? 9. if excessive static electricity is applied to the control terminals, the devices can be broken. implement some countermeasures against static electricity. ?^????????????Qr???? g? 1. fuji electric is constantly making every endeavor to improve the product quality and reliability. however, semiconductor products may rarely happen to fail or malfunction. to prevent accidents causing injury or death, damage to property like by fire, and other social damage resulted from a failure or malfunction of the fuji electric semiconductor products, take some measures to keep safety such as redundant design, spread-fire-preventive design, and malfunction-protective design. ??C?~u??|m??????u???k?` ????Cu?u???`Y?1?????b? p??p????LO????O??`?O????_? v 2. the application examples described in this specification only explain typical ones that used the fuji electric products. this specification never ensure to enforce the industrial property and other rights, nor license the enforcement rights. ??d????Cu?????h??? ??I??g??????g??SZ??? 3. the product described in this specification is not designed nor made for being applied to the equipment or systems used under life-threatening situations. when you consider applying the product of this specification to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems and submarine relaying equipment or systems, please apply after confirmation of this product to be satisfied about system construction and required reliability. ??d?u?????r??C?????? ???O??u????????u??IC?C? @C??????????H?????| ?????_J? caution if there is any unclear matter in this specification, please contact fuji electric co., ltd.


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